HDI PCB is a multi-layer circuit board with high wiring density, thin lines, spaces and micro-holes. They are designed to increase the functionality and performance of electronic products while reducing their size. High-Density Interconnect (HDI) PCBs represent technological advancements in printed circuit board design and manufacturing. These boards are known for their enhanced electrical performance and compact size.
Parameters and features:
Number of layers: HDI PCBs typically have more than two layers. Standard configurations include 4-layer, 6-layer, 8-layer, and up to 20 or more layers.
Microvias: Microvias are small, laser-drilled holes connecting different PCB layers, allowing for higher routing density.
Thin Lines/Spaces: HDI boards have narrow traces and gaps, usually measured in microns (μm). This allows for a more compact design.
Advanced Materials: HDI PCBs use advanced materials such as high-frequency laminates for optimal signal integrity and impedance control.
Aspect Ratio: Aspect ratio is the ratio of PCB thickness to microvia diameter. HDI boards usually have a high aspect ratio.
Blind and Buried Vias: These types of vias begin or end on inner layers, enhancing routing possibilities.
Via-in-Pad (VIP): This design places the via within the component bonding pad, allowing the use of smaller component sizes.
If necessary, you can click to view more of our cases.
Manufacturing process:
Lamination begins with heat and pressure to layer and bond thin core materials to create a multi-layer stack.
Drilling: Laser drilling and mechanical drilling can create micro vias and vias.
Copper Plating: After drilling, copper is deposited on the hole’s walls to create a conductive path.
Imaging: The photolithography process uses a layer of photoresist and ultraviolet light to define circuit patterns on each layer.
Etching: Chemically removing exposed copper, leaving the desired copper traces.
Copper Fill and Planarization: In the case of buried vias, any excess copper is filled and then planarized to create a flat surface.
Solder mask and screen printing: Solder mask insulates and protects copper traces, while screen printing adds component labels.
Surface Treatment: The PCB’s surface undergoes surface treatment, such as ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling).
Why choose us:
Competitive Pricing: With more than a decade of experience in the PCB industry, we have established a reliable supply chain that ensures quality components at competitive prices. For complex projects requiring unique materials or advanced technical specifications, our strong manufacturing capabilities enable us to provide cost-effective solutions while maintaining high quality.
Fast and reliable delivery: We ensure fast production and delivery. Our partnership with multiple global logistics providers guarantees timely and reliable transportation, supported by our digital factory management and 90% automation for greater efficiency.
Quality Assurance: Our rigorous quality inspection begins with incoming material checks. We use AOI to detect defects and X-rays to identify internal issues. Electrical performance testing is performed with advanced automatic test machines and flying probe testers. Before shipment, our dedicated QC team conducts a thorough manual visual inspection to ensure all products meet strict quality standards.
We have many international certifications:
We also hold several international quality certifications:
●IATF 16949:2016
●ISO 9001:2015
●ISO 45001:2018
●UL
At the same time, we are always committed to environmental protection. We have an environmental management system certification to ensure that our manufacturing process is environmentally friendly and sustainable.
Application areas
