Rigid-Flex PCB is a particular type of printed circuit board that combines rigid and flexible circuits. This design allows the board to be both rigid and flexible where rigid and flexible connections are needed.
The Rigid-Flex PCB main parameters:
Materials: Rigid-flexible PCBs typically consist of a flexible base material and a rigid base material. The flexible part usually uses polyester film (such as PI or PET), while the rigid part usually uses fiberglass-reinforced epoxy resin board (FR4).
Number of Layers: Rigid-flex PCBs can contain multiple layers depending on the specific application. Typically, they include two or more rigid layers and one or more flexible layers.
Thickness of flexible parts: The thickness of flexible parts is usually between tens and hundreds of microns, which gives them the ability to bend and fold.
The thickness of the rigid part: The tricky part is usually between 0.1 and 2.0 mm.
Line width and line spacing: Rigid-flexible PCB can achieve fine line width and line spacing, which is suitable for high-density circuits.
Manufacturing process:
Material preparation: Select appropriate rigid and flexible substrates and pretreat them to ensure bonding performance.
Layer stacking: Rigid and flexible layers are stacked together as per design requirements. This usually involves using an adhesive or evaporating a metal layer.
Drilling and Cutting: Drill holes in the desired locations and then cut or cut to define the shape of the PCB.
Circuit Patterning: Using photolithography technology to pattern circuits onto a PCB, including rigid and flexible portions.
Circuit Fabrication: Metal is deposited on a patterned substrate to fabricate circuits. This may involve multiple deposition and etching processes.
Bending and Folding: The flexible portion of a rigid-flex PCB can be bent and folded when needed to accommodate different applications.