SSD PCB is a type of printed circuit board designed specifically for use in solid-state drives, utilizing advanced materials and technologies to support high-speed data storage. These PCBs are typically used in consumer electronics, enterprise storage systems, and high-performance computing applications. The key benefits of SSD PCBs are their ability to efficiently manage data transfer, integrate flash memory chips, and ensure durability, making them an essential component in modern data storage solutions.
Key Parameters:
Copper Thickness: Typically, copper thickness ranges from 1 ounce to 3 ounces.
Dielectric Material: Typically FR4 or high-frequency laminate insulating copper layers.
Trace Width and Spacing: Narrower traces are used for high-speed signals, while wider traces are used for power transmission.
Via Size and Plating: The size of the vias and the quality of the copper plating are critical to signal reliability and the SSD’s overall performance.
Thermal Management: SSD PCBs may include thermal vias, heat sinks, or embedded copper planes to dissipate heat generated by memory chips, controllers, and other components.
Surface Finish: Common surface finishes include ENIG (electroless nickel immersion gold), HASL (hot air solder leveling), and OSP (organic solderability preservative).
Impedance Control: The PCB must be designed to control the impedance of the traces, especially for differential pairs used in data signals, to ensure that data is accurately transmitted without reflection or loss.
Component Placement and Layer Stackup: The placement of components, including flash chips, controllers, and connectors, must be optimized for signal routing and power distribution.
Electrical testing and reliability: The SSD PCB undergoes rigorous electrical testing to ensure that all signal, power, and data transfer paths function correctly.
Manufacturing Process:
Layering: The base material is layered with copper foils on both sides, forming the foundation of the SSD PCB.
Circuit Design: The SSD PCB layout ensures proper trace widths and spacing for high-speed data transfer and power delivery.
Laminating: The copper and dielectric layers are bonded under heat and pressure to form a solid PCB.
Drilling: Precision drilling creates holes for vias and components.
Copper Plating: Copper is electroplated to build up the copper traces and vias to the required thickness.
Etching: Excess copper is removed, leaving the designed circuit traces.
Solder Mask Application: A solder mask protects the copper traces and exposes only the areas where components will be soldered.
Silkscreen Printing: Component labels and other markings are printed on the surface of the PCB.
Surface Finish: A surface finish, such as ENIG or HASL, is applied to protect the copper and improve solderability.
Testing and Inspection: The final PCB is tested for electrical integrity and inspected for quality.
Case
SSD PCB
Application: High Speed SSD PCB
Layer Count: 10 Layer
Material: FR4 TG170
Board Thickness: 0.85mm +/-0.05mm
Min Trace 3/3mil
Min BGA 8mil
Min Hole 0.15mm
Surface Treatment Immersion Gold 2u’
Board Size 22mm*80mm
Panel Size 126mm*80mm/5pcs
Solder Mask Matte Black
Other Specs IG5216-2280 SSD
Application areas
